Multiple Busbars (MBB)

Densely distributed grid lines, uniform load, multi-busbars design. Output power increased by more than 5W.

Lossless laser cutting

Lossless cutting technology, no mechanical damage smooth cutting surface without burrs. Low cell cracking risks, micro-cracking is reduced by more than 50%.

Half-cut

Current density is reduced by 1/2，Internal power loss reduced to 1/4 of conventional modules；Rated output power increased by 5~10W.

New Welding Wire

Adopt round wire solder ribbon, low shading area. Multiple reflections of incident light, power increased by 1-2W.

Shading, not compromising energy

Up-down symmetrical parallel module design. Effectively reduce current mismatch due to shading.

High-Density Encapsulation Technology

The 182 Series adopts advanced high-density encapsulation technology to ensure the perfect balance of efficiency and reliability

Module efficiency increased by more than 0.15%.